Solder Joint Reliability: Theory and Applications

• Authors: John H. Lau - Lau - John H
• ISBN 10: 0442002602
• ISBN 13: 9780442002602
• Edition: 1st
• Release: January 15, 1991
• Format: Hardcover (31 pages)
• List Price: $329.00
• More Details
  
  

  List Price: $329.00

  Tags: Science, General,

  Book Description:
  Featuring the contributions of industrial academic experts in this area of electronics packaging, this volume examines solder failure - one of the reliability problems facing the modern surface-mounted electronics.

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