Mechanics of Solder Alloy Interconnects (Electrical Engineering)

• Authors: John H. Lau - Harold - Darrel R. Frear - Steven N. Burchett - Harold S. Morgan - John H. -…
• ISBN 10: 0442015054
• ISBN 13: 9780442015053
• Edition: 1994
• Release: January 1, 1993
• Format: Hardcover (418 pages)
• List Price: $295.00
• More Details
  
  

  List Price: $295.00

  Tags: Science, Physics, Mechanics,

  Book Description:
  The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

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