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Ball Grid Array Technology
by: John H. Lau
007036608X / 9780070366084

Book Description:
This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.

Ball Grid Array Technology

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