The electronics industry is abuzz with talk of flip chip technologies (FCT), the group of revolutionary new techniques that enable chips to be connected to substrates without the use of wires. By literally placing the chip upside down and in direct contact with the substrate, FCT is a highly efficient-and increasingly popular-alternative to traditional bonding techniques. This is the first book to cover all of the major design, materials, and manufacturing issues related to FCT. Featuring authoritative contributions from the world's leading experts, this volume provides in depth discussion of all five contact points.
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